PRODUCTS
Optical Communication Applicat
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Active Component Manufacturing
- Optical LD & PD Wafer
- Aspherical Lens and Cap
- TEC Device
- 2.5G-10G APD CHIP
- 10G PIN PD CHIP
- Transimpedance Amplifier
- Aluminum Nitride Substrates
- Alumina substrates
- High Temperature Co-fired Substrates (HTCC)
- 10G CWDM DFB Chip
- Microlens Array
- Smile Corrector
- Slow Axis Collimators（SAC）
- Fast Axis Collimators Arrays（FACA）
- MEMS Mirror
- SOI Wafers
- Super-thick Thermal Oxidized Wafers
- 25G DFB Laser Diode Chip
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Test and Measurement
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High Speed Qptical Transceiver
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Optical Transport Network Devi
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Network, Security and Delivery
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Optical Automation Equipments
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Passive Component Manufacturin
Industrial Laser and Optical A
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Lasers
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Laser Drivers
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Controller Electronics
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Optical Components
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Materials
Solutions
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BOSA Manufacturing and Packagi
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ECDL Stable Laser Solution
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Laser Spectroscopy Solution
TEC Device
Features:
Pico-TEC height can be 0.6mm
high performance
Ultra-small, ultra-thin
Shape, heat pump, temperature, ACR, etc. can be customized
Applications：
Pump Lasers
EML Lasers
TOSA Transceivers
TO CANS
Supplier
Founded in 2009, Phononic has been focused on the development of electronic temperature control products, its products are widely used in precision oven, server CPU and outdoor high-power equipment and other fields. Phononic combines the semiconductor manufacturing industry with TEC products to provide high performance, reliability and cost-effective TEC products.
At the same time, Phononic company in order to meet the field of optoelectronic applications, specifically into the optoelectronic division, the development of optoelectronic devices for communications applications TEC products. The latest Pico-TEC product thickness can be less than 0.6mm, very suitable for refrigeration applications need TO-CAN package products.
