PRODUCTS
Optical Communication Applicat
-
Active Component Manufacturing
- Optical LD & PD Wafer
- Aspherical Lens and Cap
- TEC Device
- 2.5G-10G APD CHIP
- 10G PIN PD CHIP
- Transimpedance Amplifier
- Aluminum Nitride Substrates
- Alumina substrates
- High Temperature Co-fired Substrates (HTCC)
- 10G CWDM DFB Chip
- Microlens Array
- Smile Corrector
- Slow Axis Collimators（SAC）
- Fast Axis Collimators Arrays（FACA）
- MEMS Mirror
- SOI Wafers
- Super-thick Thermal Oxidized Wafers
- 25G DFB Laser Diode Chip
-
Test and Measurement
-
High Speed Qptical Transceiver
-
Optical Transport Network Devi
-
Network, Security and Delivery
-
Optical Automation Equipments
-
Passive Component Manufacturin
Industrial Laser and Optical A
-
Lasers
-
Laser Drivers
-
Controller Electronics
-
Optical Components
-
Materials
Solutions
-
BOSA Manufacturing and Packagi
-
ECDL Stable Laser Solution
-
Laser Spectroscopy Solution
Alumina substrates
Features
■ Good smoothness / flatness with less porosity. Excellent in adhesion with thin film and thick film materials.
■ Less variance in outline, plate thickness, slit pitch, etc.
■ Minimal warpage, bending, and undulation.
■ Physical and chemical properties are stable even under a hot environment. Excellent in thermal shock resistance. High thermal conductivity and coefficient of thermal expansion similar to that of silicon.
■ High mechanical strength.
■ Excellent resistance against oil and chemical.
■ Excellent in insulation properties, high dielectric breakdown voltage, high surface resistivity / volume resistivity, and small dielectric constant.
■ Stable breaking strength, and less variance in shape or dimensions.
Applications
LED packages, Substrate for chip resistors, HIC substrates for heat dissipation, Power modules, FAX substrates for thermal printer head
*Various processing is available (thin film metalization, thick film metalization, glaze, etc.)
Supplier
MARUWA established an integrated production system from ceramic substrates and machined substrates to electronic components or devices, so as to be responsive to the market needs. We are on a mid-way of further integrating our technical capabilities and keep on polishing our general technologies from ceramics to circuit designing and packaging.
