Optical Communication Applicat

• Active Component Manufacturing
  1. Optical LD & PD Wafer
  2. Aspherical Lens and Cap
  3. TEC Device
  4. 2.5G-10G APD CHIP
  5. 10G PIN PD CHIP
  6. Transimpedance Amplifier
  7. Aluminum Nitride Substrates
  8. Alumina substrates
  9. High Temperature Co-fired Substrates (HTCC)
  10. 10G CWDM DFB Chip
  11. Microlens Array
  12. Smile Corrector
  13. Slow Axis Collimators（SAC）
  14. Fast Axis Collimators Arrays（FACA）
  15. MEMS Mirror
  16. SOI Wafers
  17. Super-thick Thermal Oxidized Wafers
  18. 25G DFB Laser Diode Chip
• Test and Measurement
  1. Digital Communication Analyzer
  2. Bit-Error-Rate Tester
  3. RF Test Fixture
• High Speed Qptical Transceiver
  1. 1~4Gbps VCSEL TO-can
  2. 10Gbps VCSEL TO-can
  3. 1~4Gbps LC SC TOSA & ROSA
  4. 10Gbps LC SC TOSA & ROSA
  5. 10G PIN/APD TIA TO
  6. 10G-40G Transmitter and Receiver Components
  7. Cage, Cover and Heat Sink
  8. Host Connectors and Plug Connectors
  9. 40G-100G High Frequency RF Coaxial Connector
  10. RF Probe
• Optical Transport Network Devi
• Network, Security and Delivery
• Optical Automation Equipments
• Passive Component Manufacturin

Industrial Laser and Optical A

• Lasers
  1. Single Mode Laser Diodes
  2. Tunable laser light source
  3. Twin DFB Diode Laser
  4. Stabilized & Tunable Diode Laser
  5. 2000nm—3500nm Mid‐IR DFB Lasers
  6. 1300nm—1800nm Near‐IR DFB Lasers
  7. Tapered Amplifiers
  8. Gain Chips
  9. Single Frequency Laser Diodes
  10. Multimode Laser Diodes
• Laser Drivers
  1. Thermistors
  2. QCL Series Low Noise Quantum Cascade Laser Drivers
  3. Temperature Controllers
  4. Temperature Controller and Laser Diode Driver
  5. Laser Diode Drivers
  6. Analog Temperature Control Instrument
• Controller Electronics
  1. CoSy
  2. LaseLock
• Optical Components
• Materials

Solutions

• BOSA Manufacturing and Packagi
  1. BOSA Manufacturing and Packaging Solution
• ECDL Stable Laser Solution
  1. ECDL Stable Laser Solution
• Laser Spectroscopy Solution